If you have ever had issues with solder mask encroachment, then you need to download our Preventing Solder Migration Through PCB Vias tip sheet set.
These tip sheets are designed as a resource, in a rapid read format, which makes them great for reference when working on a circuit board project.
Epec offers a variety of printed circuit board manufacturing solutions for via processing requirements. Whether you require vias flooded with mask, selective plugging in BGA areas, conductive and non-conductive epoxy fill, or fully plugged and via in pad, we have you covered.
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