6 Key Elements to Maximize Material Usage and Improve Yields

Inside the Flex & Rigid-Flex PCB Array Panelization Ebook, you will learn that flexible and rigid-flex circuit technologies have additional elements, beyond those of rigid PCBs, that require review and consideration when creating assembly arrays that maximize material utilization and improve manufacturing yield rates.

Insiders Look:

  • Assembly Array Configuration
  • Material Tolerances
  • Impact of Flex and Rigid-Flex Technology
  • And more…

Beyond the technology of the design and its size and shape, material usage and yield rates are the two elements that have the most significant impact on the cost of a design and ensuring complete and on-time deliveries. An optimized array also addresses yield rates and throughput at the component assembly process.

Flex & Rigid-Flex PCB Array Panelization

Whether the part is a flex only with stiffeners or a rigid-flex, the size and shape of the design, the material requirements, the number and location(s) of rigid areas, the number of rigid and flex layers, stiffener, and PSA requirements all combine to determine the optimum array configuration.

Learn These 6 Key Elements 

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